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Roman Caudillo is a Ph.D. Materials Scientist with over 18 years of R&D experience in the semiconductor industry. His scientific contributions at Intel’s advanced technology groups span the 65nm to 18A semiconductor technology nodes with technical emphasis in the areas of novel materials, nanotechnology, integration, advanced lithography, spintronics, and quantum computing. He led superconducting qubit fabrication efforts at Intel, fabricating Intel’s first Josephson junctions and superconducting qubits, and led a team of engineers to deliver a flip-chip packaged 49-qubit chip showcased at CES in 2018. Roman is also an industry collaboration leader and recently served as Director of JUMP 2.0 for SRC, where he led $300M of collaborative microelectronics research with support from DARPA and 15 corporate sponsors.
